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Intel® Xeon® Processor 7400 Series Datasheet 3

Contents

1Introduction..............................................................................................................9

1.1 Terminology .....................................................................................................11

1.2 State of Data....................................................................................................13

1.3 References .......................................................................................................13

2 Electrical Specifications...........................................................................................15

2.1 Front Side Bus and GTLREF ................................................................................ 15

2.2 Decoupling Guidelines........................................................................................16

2.2.1 VCC

Decoupling......................................................................................16

2.2.2 VTT

Decoupling......................................................................................16

2.2.3 Front Side Bus AGTL+ Decoupling ............................................................16

2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking....................................... 16

2.3.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17

2.3.2 PLL Power Supply................................................................................... 18

2.4 Voltage Identification (VID) ................................................................................ 18

2.5 Reserved, Unused, or Test Signals.......................................................................20

2.6 Front Side Bus Signal Groups..............................................................................20

2.7 CMOS Asynchronous and Open Drain Asynchronous Signals.................................... 22

2.8 Test Access Port (TAP) Connection.......................................................................22

2.9 Mixing Processors.............................................................................................. 23

2.10 Absolute Maximum and Minimum Ratings .............................................................23

2.11 Processor DC Specifications ................................................................................24

2.11.1 Flexible Motherboard Guidelines (FMB)......................................................24

2.11.2 V

Overshoot Specification.....................................................................33

2.11.3 Die Voltage Validation.............................................................................33

2.11.4 Platform Environmental Control Interface (PECI) DC Specifications................34

2.11.4.1 DC Characteristics.....................................................................34

2.11.4.2 Input Device Hysteresis.............................................................35

2.12 AGTL+ FSB Specifications................................................................................... 35

2.13 Front Side Bus AC Specifications ......................................................................... 37

2.14 Processor AC Timing Waveforms .........................................................................41

3 Mechanical Specifications........................................................................................51

3.1 Package Mechanical Drawing...............................................................................51

3.2 Processor Component Keepout Zones...................................................................54

3.3 Package Loading Specifications ...........................................................................60

3.4 Package Handling Guidelines............................................................................... 61

3.5 Package Insertion Specifications..........................................................................61

3.6 Processor Mass Specifications ............................................................................. 61

3.7 Processor Materials............................................................................................ 61

3.8 Processor Markings............................................................................................ 62

3.9 Processor Pin-Out Coordinates ............................................................................ 63

4 Pin Listing ...............................................................................................................65

4.1 Processor Pin Assignments .................................................................................65

4.1.1 Pin Listing by Pin Name...........................................................................65

4.1.2 Pin Listing by Pin Number........................................................................73

5 Signal Definitions .................................................................................................... 81

5.1 Signal Definitions .............................................................................................. 81

6 Thermal Specifications ............................................................................................89

6.1 Package Thermal Specifications........................................................................... 89

6.1.1 Thermal Specifications............................................................................89

6.1.2 Thermal Metrology ................................................................................. 97

1 2 3 4 5 6 7 8 ... 135 136

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Lenovo AD80582QH056003 Scheda Tecnica Pagina 3

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