Lenovo AD80582QH056003 Scheda Tecnica Scaricare il pdf (Pagina 90)

Thermal Specifications

90 Intel® Xeon® Processor 7400 Series Datasheet

enabled 2U heatsink). In this scenario, it is expected that the Thermal Control Circuit

(TCC) would only be activated for very brief periods of time when running the most

power intensive applications. Intel has developed the thermal profile to allow

customers to choose the thermal solution and environmental parameters that best suit

their platform implementation. Refer to the Intel® Xeon® Processor 7400 Series

Thermal Mechanical Design Guide for details on system thermal solution design,

thermal profiles and environmental considerations.

The Intel® Xeon® Processor E7400 Series (see Figure 6-2; Table 6-3) and Intel®

Xeon® Processor L7400 Series (see Figure 6-4; Table 6-5) supports a single Thermal

Profile. The Thermal Profiles are indicative of a constrained thermal environment

(Ex: 1U form factor). Because of the reduced cooling capability represented by this

solution, the probability of TCC activation and performance loss is increased.

Additionally, utilization of a thermal solution that does not meet the Thermal Profile will

violate the thermal specifications and may result in permanent damage to the

processor. Refer to the Intel® Xeon® Processor 7400 Series Thermal Mechanical

Design Guide for details on system thermal solution design, thermal profiles and

environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) and

the associated T

CASE

value. It should be noted that the upper point associated with

Intel® Xeon® X7460 Processor Thermal Profile (x = TDP and y = T

CASE_MAX

P @ TDP)

represents a thermal solution design point. In actuality the processor case temperature

will not reach this value due to TCC activation (see Figure 6-1 for the Intel® Xeon®

X7460 Processor).

Analysis indicates that real applications are unlikely to cause the processor to consume

maximum power dissipation for sustained time periods. Intel recommends that

complete thermal solution designs target the Thermal Design Power (TDP) instead of

the maximum processor power consumption. The Intel Thermal Monitor feature is

intended to help protect the processor in the event that an application exceeds the TDP

recommendation for a sustained time period. For more details on this feature, refer to

Section 6.2. To ensure maximum flexibility for future requirements, systems should be

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower

power dissipation is currently planned. Intel Thermal Monitor or Intel Thermal

Monitor 2 feature must be enabled for the processor to remain within its

specifications.

1 2 ... 85 86 87 88 89 90 91 92 93 94 95 ... 135 136

Nessun commento

Lenovo AD80582QH056003 Scheda Tecnica Pagina 90