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Intel® Xeon® Processor 7400 Series Datasheet 61
Mechanical Specifications
3.4 Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
3.5 Package Insertion Specifications
The Intel® Xeon® Processor 7400 Series can be inserted into and removed from a
mPGA604 socket 15 times. The socket should meet the mPGA604 requirements
detailed in the mPGA604 Socket Design Guidelines.
3.6 Processor Mass Specifications
The typical mass of the Intel® Xeon® Processor 7400 Series is 37.6 g (1.5oz). This
mass [weight] includes all the components that are included in the package.
3.7 Processor Materials
Table 3-3 lists some of the package components and associated materials.
Table 3-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 356 N [80 lbf]
1,
2
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
Tensile 156 N [35 lbf]
3,
2
3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
Torque 8 N-m [70 lbf-in]
4,
2
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber-Reinforced Resin
Substrate Pins Gold Plated Copper
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